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eMCP
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Embedded Multi Chip Package （eMCP）

eMCP embedded multi chip package (eMMC + Multi Chip Package), eMMC combined with MCP package,
compared with the traditional MCP, Flash control chip NAND eMCP,
can be more effective management of large capacity flash memory, and reduce the burden of the main chip operation
JSCJSC Semiconductor has succeeded in successively developing new products such as mobile ram (CellularRam) and LP DDR SDRAM since recognition of its technical strength.The following are the product parameters of eMCP（Embedded Multi Chip Package）：4Gb/8Gb + 2Gb Density；162B (11.5mm x 13mm) Package Type；HS400 Speed；LPDDR2 1CS DRAM.
Part number Density NAND Type DRAM eMMC Speed Package Type Download
JSMPGB1BA1HYAABD-H418 8Gb + 2Gb MLC LPDDR2 1CS eMMC 5.0 HS400 162B (11.5mm x 13mm) Contact Us
JSMPGC1GA1HYAABD-H418 8Gb + 2Gb MLC LPDDR2 1CS eMMC 5.0 HS400 162B (11.5mm x 13mm) Contact Us
JSMPFB1BD1AVAABD-H418 4Gb + 2Gb TLC LPDDR2 1CS eMMC 5.0 HS400 162B (11.5mm x 13mm) Contact Us
JSMPFC1GD1AVAABD-H418 4Gb + 2Gb TLC LPDDR2 1CS eMMC 5.0 HS400 162B (11.5mm x 13mm) Contact Us
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